| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which is capable of making an insulating layer uniform in thickness distribution independently of whether a conductor circuit is dense or coarse. SOLUTION: This method is for manufacturing a wiring board which is equipped with the conductor circuit 102 that is formed on the surface of a base material 101 of a continuous length protruding upright, a belt-like region 103 where the conductor circuit crossing the base material in the widthwise direction is not present, and an insulating layer 105 covering surfaces of the conductor circuit and the base material. The method comprises processes of forming a protruding conductor circuit on the surface of the base material of continuous length, laminating the insulating layer on the conductor circuit, and heating/pressing the surface of the insulating layer by a press 111. COPYRIGHT: (C)2004,JPO&NCIPI
|
