发明名称 HOT MELT COMPOSITION
摘要 PROBLEM TO BE SOLVED: To solve problems arising from resin degradation aggravated after prolonged high-temperature use and from the resin stuck fast to junctions of parts under such circumstances for making disassembly for maintenance difficult in cases where, for instance, a silicone resin or the like is used as a sealant for protecting components and parts in a heating apparatus or the like from water or dust. SOLUTION: The hot melt composition comprises a hydrogenated paraffin oil, a high molecular weight styrene-based block polymer, a (modified) polyphenylene ether resin, a tackifier resin, and an oxidation inhibitor. The composition remains free of degradation and high in sealing capability after prolonged exposure to high temperatures, and assemblies sealed by the composition are readily disassembled. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004189844(A) 申请公布日期 2004.07.08
申请号 JP20020358299 申请日期 2002.12.10
申请人 AICA KOGYO CO LTD 发明人 IWATSUKA YUJI;MIWA TOMOHIRO
分类号 C08L53/02;C08K5/00;C08L91/00;(IPC1-7):C08L53/02 主分类号 C08L53/02
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