发明名称 METHOD AND DEVICE FOR CONNECTING SEMICONDUCTOR ELEMENTS
摘要 PROBLEM TO BE SOLVED: To improve the production efficiency for the connection of semiconductor elements. SOLUTION: A purge nozzle 8 for spraying inert gas to a junction part between an optical element and a submount is connected to a heating/cooling means 14 via an electromagnetic valve by means of inert gas supply pipes 6, 7, and an inert gas supply tube 10 is disposed in a ceramic heater 11 which heats a submount 12. In junction of the optical element, heated inert gas is sprayed to the junction part, and in cooling, cooled inert gas is sprayed to the junction part, and the ceramic heater is cooled. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004193539(A) 申请公布日期 2004.07.08
申请号 JP20030057052 申请日期 2003.03.04
申请人 JUKI CORP 发明人 SAITO MASARU;ANZAI HIROSHI;HACHIMAN NAOYUKI
分类号 H01L21/52;H01L31/02;H01S5/022;(IPC1-7):H01L21/52 主分类号 H01L21/52
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