| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method which enables an object to be polished to be torn off from a polishing surface easily and safely without using an overhanging method and which has improved throughput. <P>SOLUTION: In the polishing method, a table 100 having the polishing surface 101 and a top ring 1 holding a semiconductor wafer W are rotated, and the polished surface of the semiconductor wafer W held by the top ring 1 is pressed against the polishing surface 101 of the table 100 to polish the semiconductor wafer W. When separating the semiconductor wafer W held by the top ring 1 from the polishing surface 101 of the table 100 after polishing the semiconductor wafer W, the rotational speed of the table 100 is lowered than that at the time of polishing, and a difference is caused in rotational speed between the top ring 1 and the turn table 100. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
