| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor device with a layer-built package for relaxing external stress and facilitating positioning. SOLUTION: This sensor device 1 is equipped with a recess-formed layer-built package 2 comprising a base part 5 and a frame part 6 layered in a frame-part layering area 5a on the periphery of the base part 5, and a sensor chip 3 mounted on a sensor chip mounting area 5b of the base part 5 on the frame part 6 forming surface side. The mounting area 5b and the layering area 5a of a substrate 2b for package formation, these constituting the base part 5, are connected to each other by a connection part 7, whereby the base part 5 in a connection-part non-forming area 9 is made into a thin-walled part 8. Since this sensor device 1 is equipped with the thin-walled part 8 in the package 2, external stress can be absorbed by the thin-walled part 8, and the substrate for package formation can be easily positioned because the mounting area 5b is connected to the layering area 5a by the connection part 7. COPYRIGHT: (C)2004,JPO&NCIPI
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