发明名称 VORRICHTUNG ZUM ZUSAMMENBONDEN PLATTENFÖRMIGER OBJEKTE UND VERFAHREN ZUM ZUSAMMENBONDEN PLATTENFÖRMIGER OBJEKTE
摘要 <p>Adhering apparatus for plate shaped matter includes absorbing-and-holding means 10, 20 serving also as electrodes for absorbing and holding respectively first optical disc substrate 1 and second optical disc substrate 2, optical disc substrate moving means 40 for moving second optical disc substrate 2 to be approached to first optical disc substrate, distance detecting means 50 for detecting the distance between optical disc substrates, velocity controlling means 60 for controlling a relative velocity of the second plate shaped matter to the first plate shaped matter and controlling the plate shaped matter moving means in such a manner that the relative velocity immediately after and at a time point at which the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter is slower than that immediately before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter; and voltage application means 71 for applying voltage between the first plate shaped matter and the second plate shaped matter before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter. <IMAGE></p>
申请公布号 DE02712295(T1) 申请公布日期 2004.07.08
申请号 DE20020712295T 申请日期 2002.02.08
申请人 ORIGIN ELECTRIC CO. LTD., TOKIO/TOKYO 发明人 SHINOHARA, SHINICHI;KOBAYASHI, HIDEO;NAKAMURA, MASAHIRO;KAJI, KANYA
分类号 C09J5/02;B29C65/52;C09J5/04;G11B7/26;(IPC1-7):C09J5/00 主分类号 C09J5/02
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