| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition curable at a low temperature. <P>SOLUTION: This resin composition contains a resin composed of a structural unit expressed by general formula (1) [R<SP>1</SP>and R<SP>2</SP>are each H, D (deuterium), F, Cl, Br, CF<SB>3</SB>, a 1-10C alkyl or a 6-20C aryl, and may be identical to or different from each other; or R<SP>1</SP>and R<SP>2</SP>may be combined with each other to form an organic radical; Ra is a 1-30C monovalent organic group having at least one functional group selected from carboxy, phenolic hydroxy, sulfonic acid, and thiol]. An insulating film is given by using the composition. A semiconductor device and an organic electroluminescent element are each given by using the film. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
