FILM CARRIER TAPE FOR MOUNTING ELECTRONIC COMPONENT, ITS MANUFACTURING METHOD, AND PLATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a film carrier tape for mounting an electronic component which has a tin/bismuth alloy layer formed on its terminal and wherein bismuth is homogeneously contained in the alloy layer. SOLUTION: In the film carrier tape for mounting the electronic component, the tin/bismuth alloy plated layer has a substantially uniform bismuth content in its thickness direction. The layer can be manufactured by plating at least part of a wiring pattern with the tin/bismuth alloy and then cleaning the plated alloy layer within 6 seconds with water ejected from a water cleaning nozzle. A plating device used herein has such a nozzle that can water-clean a film carrier taken out from a plating bath within 6 seconds. Using the equipment, metal tin in the surface of the tin/bismuth alloy plated layer is replaced by bismuth contained in a plating solution. Consequently, the alloy plated layer can be stably bonded without fluctuating the metal composition of the surface of the alloy plated layer. COPYRIGHT: (C)2004,JPO&NCIPI