| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package that can be reduced in size with high heat dissipating performance wherein wire bonding can be applied to an interposer substrate. SOLUTION: A large number of solder balls 3 are placed on the lower face 1a of the interposer substrate 1 via a land 2. A semiconductor chip 4 is mounted on the upper face 1b of the interposer substrate 1 via a heat sink 6 in a face-up manner. The heat sink 6 has a through-part 7a to expose substrate side electrodes 5. The substrate side electrodes 5 provided on a semiconductor chip mount face 1b of the interposer substrate 1 and chip side electrodes 9 provided to the semiconductor chip 4 are electrically connected by using bonding wires 10. A heat dissipation lid 11 is placed at the heat sink 6 so as to be coupled close to the semiconductor chip 4 and the heat dissipation lid 11 has a recess 13 in which the chip 4 is contained. COPYRIGHT: (C)2004,JPO&NCIPI
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