| 摘要 |
PROBLEM TO BE SOLVED: To provide equipment for sealing with resin, which does not need special processing before sealing with resin, simplifies a die structure and die maintenance, and improves the mold quality. SOLUTION: Sealing with resin is carried out by carrying a cavity plate 11 in a pressing section 5, which has a bored cavity hole 13 defining the external form and thickness of a work 2 and a package 36 and is capable of repeatedly carrying in and out, and then aligning it a molded die 6 to clamp. COPYRIGHT: (C)2004,JPO&NCIPI
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