发明名称 DRIP-PROOF STRUCTURE OF ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain a drip-proof structure of an electronic apparatus which has superior assemblability, is improved in stability and can be obtained within a general casing thickness range, and to provide a packing which surely protects the through-hole of a casing in a drip-proof state and is hardly lost. SOLUTION: A circumferential groove 9 is formed the an opening end face of an upper case A. The circumferential portion 6 of a packing 5, having a projection 10 that is engaged with the circumferential groove 9, a support 11 extending from the projection and held between the opening end face of the upper case and the opening end face of a lower case B and a projection 12 formed opposite to the projection 10 with the support between pressed with the opening end face of the lower case B, is provided and fixed between opening end faces of the upper and lower cases A, B. A hole packing integrally linked to the circumferential portion is provided outside the casing, and the through-hole of the casing is sealed therewith. Since the projection 10 is inserted into the circumferential groove, and the support is placed on the end face of the case A, stability is improved and assembling is facilitated. Since the edge of the lower case B presses the projection 12, drip-proof performance is ensured. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004193496(A) 申请公布日期 2004.07.08
申请号 JP20020362621 申请日期 2002.12.13
申请人 YAMAGATA CHINOO:KK;CHINO CORP 发明人 YOSHIIZUMI TORU;SUZUKI YUKIHISA;MURAI HIROSUKE
分类号 H05K5/06;H05K5/02;(IPC1-7):H05K5/06 主分类号 H05K5/06
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