| 摘要 |
PROBLEM TO BE SOLVED: To provide a high vacuum envelope by an easy and inexpensive manufacturing method by using a small manufacturing device. SOLUTION: In a sealing method of a W-In composition, a lower side substrate and a frame are joined at an edge portion. In addition, a frame part faying surface is chamfered, and an undercoating layer for enhancing anti-leakage performance is formed in a junction portion. COPYRIGHT: (C)2004,JPO&NCIPI
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