发明名称 |
Polymer film metalization |
摘要 |
Embodiments in accordance with the present invention eliminate the need for a subtractive metal patterning process to pattern the electrode above a ferroelectric polymer. Instead, a selective electroless deposition process is used. A conductive polymer is used as a seed layer for the electroless plating of the metal electrode. A cost saving is provided by eliminating the chemical costs associated with conventional resist removal processing. The methods also potentially eliminate the requirement for aggressive and environmentally unsafe chemical-based photoresist removal processes.
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申请公布号 |
US2004132285(A1) |
申请公布日期 |
2004.07.08 |
申请号 |
US20030337960 |
申请日期 |
2003.01.06 |
申请人 |
ANDIDEH EBRAHIM;DIANA DANIEL C. |
发明人 |
ANDIDEH EBRAHIM;DIANA DANIEL C. |
分类号 |
C25D5/02;C25D7/12;H01L21/00;H01L21/28;H01L21/288;H01L21/44;H01L21/768;H01L21/8242;(IPC1-7):H01L21/44 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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