发明名称 |
Pre-loaded plasma reactor apparatus and application thereof |
摘要 |
A pre-loaded plasma-based processing system comprises a pre-reaction plasma processing chamber, a power source disposed in operable communication with the pre-reaction plasma processing chamber, and a wafer plasma processing chamber disposed in fluid communication with the pre-reaction plasma processing chamber. The pre-reaction plasma processing chamber is configured to effect a plasma-based chemical reaction of reactant materials to produce a reactive radical. The wafer plasma processing chamber is configured to react the reactive radical with a species at a surface of a wafer disposed in the wafer plasma processing chamber. Other embodiments include a method of processing a wafer in a plasma environment and preloading of the reactive gas stream to prevent erosion of wafer masking or etch stop layers.
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申请公布号 |
US2004129385(A1) |
申请公布日期 |
2004.07.08 |
申请号 |
US20030336148 |
申请日期 |
2003.01.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
WISE RICHARD;HAKEY MARK CHARLES;PANDA SIDDHARTHA;CHEN BOMY A. |
分类号 |
H05H1/46;C23C16/513;H01J37/32;H01L21/00;H01L21/205;H01L21/306;H01L21/3065;H01L21/308;(IPC1-7):H01L21/306 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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