发明名称 FORCE-DETECTING ELEMENT, MANUFACTURING METHOD THEREOF, AND WAFER FOR MANUFACTURING THE FORCE DETECTION ELEMENT
摘要 PROBLEM TO BE SOLVED: To realize a technology for improving the quality and reliability of a force-detecting element. SOLUTION: To an electrode 132c on an electrode stage 136c of a first block 120, a needle 144 connected to the an anode of a power source 150 is contacted. To an electrode 142, attached at the bottom of a semiconductor substrate 122 of the first block 120, a needle 140 connected to the anode of the power source 150 is contacted. Also, a needle 148 connected to the cathode of the power source 150 is contacted to an electrode 146 attached to the top surface of the second block 138. Then, a voltage is impressed with the power source 150. Thus, owing to the presence of insulation layer 124 between the semiconductor substrate 122 and a semiconductor gauge 126, lowering of the junction voltage is suppressed. Also, impressing of high voltage to the insulation layer 124 between the semiconductor substrate 122 and the semiconductor gauge 126 can be avoided. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004191279(A) 申请公布日期 2004.07.08
申请号 JP20020361821 申请日期 2002.12.13
申请人 TOYOTA CENTRAL RES & DEV LAB INC 发明人 OMURA YOSHITERU;MIZUNO KENTAROU;SAKATA JIRO;TSUKADA ATSUSHI;HASHIMOTO SHOJI;MASUOKA MASAYOSHI
分类号 G01L1/18;H01L29/84;(IPC1-7):G01L1/18 主分类号 G01L1/18
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