发明名称 |
RESIN COMPOSITION FOR CURABLE MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for curable molding capable of reducing a gas generating from the molding so that it can fully exert the functions of the molding. SOLUTION: This resin composition for curable molding is prepared by compounding a 19-25C fatty acid metal soap as a mold release agent to a curable resin composition containing at least either one of an unsaturated polyester resin or a vinyl ester resin as a curable resin component. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004189855(A) |
申请公布日期 |
2004.07.08 |
申请号 |
JP20020358506 |
申请日期 |
2002.12.10 |
申请人 |
KYOCERA CHEMICAL CORP;KYOCERA CHEMICAL REINFORCED PLASTICS CO LTD |
发明人 |
KOWADA FUJIO |
分类号 |
C08L67/06;C08K3/00;C08K5/09;C08L63/10;(IPC1-7):C08L67/06 |
主分类号 |
C08L67/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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