发明名称 RESIN COMPOSITION FOR CURABLE MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition for curable molding capable of reducing a gas generating from the molding so that it can fully exert the functions of the molding. SOLUTION: This resin composition for curable molding is prepared by compounding a 19-25C fatty acid metal soap as a mold release agent to a curable resin composition containing at least either one of an unsaturated polyester resin or a vinyl ester resin as a curable resin component. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004189855(A) 申请公布日期 2004.07.08
申请号 JP20020358506 申请日期 2002.12.10
申请人 KYOCERA CHEMICAL CORP;KYOCERA CHEMICAL REINFORCED PLASTICS CO LTD 发明人 KOWADA FUJIO
分类号 C08L67/06;C08K3/00;C08K5/09;C08L63/10;(IPC1-7):C08L67/06 主分类号 C08L67/06
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