发明名称 |
Electrolytic processing apparatus and method |
摘要 |
There is provided an electrolytic processing apparatus and method that can improve the flatness of a plated film on a substrate even when fine grooves and large grooves are co-present in the surface of the substrate, enabling a later CMP processing to be carried out in a short time while preventing dishing during the CMP processing. An electrolytic processing apparatus according to an embodiment of the present invention includes: a substrate holder for holding a substrate; a first electrode to make contact with the substrate for passing electricity to a processing surface of the substrate; an electrode head including a high resistance structure and a second electrode, disposed opposite to and in this order from the substrate holder, and a polishing surface facing the processing surface of the substrate held by the substrate holder; an electrolytic solution injection portion for injecting an electrolytic solution between the processing surface of the substrate held by the substrate holder and the second electrode; a relative movement mechanism for moving the substrate holder and the electrode head relative to each other; a press mechanism for pressing the polishing surface of the electrode head against the substrate held by the substrate holder; and a power source for applying a voltage between the first electrode and the second electrode, the power source being capable of selectively switching the direction of electric current.
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申请公布号 |
US2004129576(A1) |
申请公布日期 |
2004.07.08 |
申请号 |
US20030724044 |
申请日期 |
2003.12.01 |
申请人 |
MAKINO NATSUKI;KUNISAWA JUNJI |
发明人 |
MAKINO NATSUKI;KUNISAWA JUNJI |
分类号 |
C25B9/00;C25D5/18;C25D7/12;C25D17/00;(IPC1-7):C25D17/00 |
主分类号 |
C25B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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