| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tube joining device which can reduce a chance of a transportation fault of a cutting member and prevent a defect of a device due to a fixation of pulverized powder. <P>SOLUTION: When the tube joining device performs a paying-out of the wafer 41, the wafer 41 is sent into a wafer holder 140 by a contact with an internal bottom surface portion of a wafer cassette and sent forward moving along a transport route 105. In this transportation movement, a bottom and a side part of the wafer 41 make a rubbing contact with the transportation route 105 and a wall 104 of the wafer holder 140 as well as the internal bottom surface portion of the wafer cassette 120, and consequently a part of both surfaces is scraped off to block the transport route of the wafer 41 by the fixation of the powdered materials to the wall 104 when an electric current is supplied to the wafer 41. A recessed 101 or a dimple 102 is formed in the wall of the wafer holder 140 so that the transportation fault of the wafer 41 due to the fixation of the powdered material is prevented. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
