发明名称 MULTIPLE-TAKING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multiple-taking wiring board in which a contrast difference between a positioning mark and an insulating layer is enlarged, and an electrical inspection terminal is accurately contacted at a predetermined position of a wiring conductor to conduct accurate electrical inspection, when conducting electrical inspection. SOLUTION: On an approximately plate-like mother board 8 formed by laminating a plurality of insulating layers 1, a plurality of wiring board regions 6 with each being equipped with a wiring conductor 2 composed of conductor layers which are attached among upper and lower surfaces of the mother board and the insulating layers 1, and located at mutually facing positions on the upper and lower surfaces in the vicinity of the wiring board regions 6, a plurality of frame-like positioning marks 5 which do not transmit light are formed for confirming the positions of the wiring board regions 6, by simultaneously having the upper and lower surfaces irradiated with light transmitted through the mother board 8. In such a multiple-taking wiring board, the mother board 8 is formed of a light-shielding layer 7 which blocks light between the insulating layers 1 mutually facing the frame-like positioning marks 5. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004193504(A) 申请公布日期 2004.07.08
申请号 JP20020362824 申请日期 2002.12.13
申请人 KYOCERA CORP 发明人 SHIKADA HIDENORI
分类号 H05K1/02;H01L23/12;H05K3/46;(IPC1-7):H01L23/12 主分类号 H05K1/02
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