发明名称 LASER BEAM WORKING APPARATUS AND LASER BEAM WORKING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam working apparatus and a laser beam working method which can uniformly work at high speed, even in the case that holes to be worked are arranged with irregular pattern. <P>SOLUTION: The laser beam 3 is divided into two directions with a laser path dividing means 7 and also, the laser beams 3 divided into the two directions are adjusted so that the axis in these centers is same with a beam path adjustment means 12. Further, in a single-hole beam path 8, one hole mask 10 is disposed and in a poly-hole beam path 9, a poly-hole mask 11 for poly-holes, is disposed between the beam path dividing means 7 and the beam path adjustment means 12, respectively, and also, a deflection means 13 is arranged between the beam path adjustment means 12 and a work 15. Then, either one in two beam paths of the laser beam 3 is positioned according to the working pattern. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004188487(A) 申请公布日期 2004.07.08
申请号 JP20020362936 申请日期 2002.12.13
申请人 HITACHI VIA MECHANICS LTD 发明人 SUGAWARA HIROYUKI;MORI SADAO;AOYAMA HIROSHI
分类号 G02B26/10;B23K26/00;B23K26/04;B23K26/06;B23K26/067;B23K26/38;B23K101/42;G02F1/33;(IPC1-7):B23K26/04 主分类号 G02B26/10
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