发明名称 HEAT TRANSPORT DEVICE AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat transport device suitable for miniaturization and thickness reduction with a little angle dependence relative to the gravity. SOLUTION: In the heat transport device connecting an evaporating part 7 and a condensing part 8 with a gas phase path and a liquid phase path, many grooves 12 are radially formed in the horizontal view so that wick parts 12u, 12d of the condensing part 8 have a symmetrical structure around the axis orthogonal to the direction of the gravity. Even if the heat transport device is inclined by an arbitrary angle with respect to the horizontal plane or the vertical plane, the flow of the working fluid of the liquid phase is not prevented in the wick parts 12u, 12d. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004190979(A) 申请公布日期 2004.07.08
申请号 JP20020361022 申请日期 2002.12.12
申请人 SONY CORP 发明人 MAKINO TAKUYA;MOCHIZUKI TAKASHI;HORI KAZUHITO;KOGA KAZUYOSHI;SAKATA NORIAKI
分类号 F28D15/02;F28D15/04;H01L23/427;H04N5/225;(IPC1-7):F28D15/02 主分类号 F28D15/02
代理机构 代理人
主权项
地址