| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoset electroconductive adhesive that can homogeneously disperse electroconductive particles with inhibition of electroconductive metal migration and additionally can improve the adhesion in well balance by formulating a compound having a molecular structure bearing divalent sulfur atoms. SOLUTION: The thermoset electroconductive adhesive contains a compound bearing a divalent sulfur atom in the molecule and includes electroconductive fillers. Further, the thermoset electroconductive adhesive is a compound in which the divalent sulfur-bearing compound has the sulfide structure. COPYRIGHT: (C)2004,JPO&NCIPI
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