发明名称 Method and apparatus for mounting electronic components and program therefor
摘要 Disclosed is an electronic component mounting apparatus, which is provided with a board transfer device for transferring circuit boards and a pair of component supply devices arranged with the board transfer device therebetween for supplying electronic components on the boards. Of the component supply devices, one of them is designated as main component supply device for primarily supplying the electronic components on the boards, and the other is designated as secondary component supply device for supplying the electronic components as long as the component supply from the main component supplying device is discontinued. The electronic component mounting apparatus performs a switching control so that the electronic components are supplied from the main component supply device during the ordinary mounting operation, but from the secondary component supply device when th component supply from the main component supplying device is discontinued.
申请公布号 US2004130863(A1) 申请公布日期 2004.07.08
申请号 US20030669552 申请日期 2003.09.25
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 SHIMIZU KOUJI;TERUI SEIICHI
分类号 H05K13/02;H05K5/00;H05K13/04;H05K13/08;(IPC1-7):H05K5/00 主分类号 H05K13/02
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