发明名称 |
KLEBSTOFF, VERFAHREN ZUR VERBINDUNG UND ANORDUNGEN VON MONTIERTEN LEITERPLATTEN |
摘要 |
The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability. <IMAGE> |
申请公布号 |
DE69821350(T2) |
申请公布日期 |
2004.07.08 |
申请号 |
DE1998621350T |
申请日期 |
1998.05.11 |
申请人 |
FUJITSU LTD., KAWASAKI |
发明人 |
DATE, HIROAKI;MOTOYAMA, YUKO;TOKUHIRA, HIDESI;USUI, MAKOTO;IMAIZUMI, NOBUHIRO |
分类号 |
C09J4/06;C09J4/02;C09J5/06;C09J9/02;C09J163/00;H01L21/56;H01L21/60;H05K1/03;H05K3/30;H05K3/38 |
主分类号 |
C09J4/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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