| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method to manufacture easily and stably a polishing pad that has a small polishing characteristic change over aging and can stabilize polishing even at the beginning of use, the polishing pad that is obtained by the manufacturing method, and a method for manufacturing a semiconductor device using the polishing pad. <P>SOLUTION: The method for manufacturing the polishing pad includes a step where a polishing layer 13, a cushion layer 10 and at least one double-faced tape 11 and 12 are adhered to each other and they are cut into a specified size. In concrete, the step includes a lamination step where the polishing layer 13, the cushion layer 10 and at least one double-faced tape 11 and 12 are stacked to form a lamination member, a preliminary adhesion step where the lamination member is preliminarily adhered to form a preliminary lamination member, a substantial adhesion step where the preliminary lamination member is adhered to form a substantial lamination member, and a cutting step where the substantial lamination member is cut into a specified size. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
