| 摘要 |
<P>PROBLEM TO BE SOLVED: To secure an external-form-of-stem recognizing area and a bonding area at the time of performing wiring bonding. <P>SOLUTION: A groove 27 is formed on the flat surface 22a of a heat radiating stand 22 by highly rising both outer sides of the surface 22a and a sub-mount 26 is mounted on the bottom face of the groove 27. Consequently, the external-form-of-stem recognizing area and the bonding area for driving an Au wire 30, both of which are required at the time of performing wire bonding from the sub-mount 26, can be secured easily, because the spread of Ag paste 29 can be limited after the sub-mount 26 is die-bonded. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
