发明名称 CONDUCTIVE PASTE AND SEMICONDUCTOR DEVICE USING IT
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste excellent in a conductivity in a direction orthogonal to a conductive paste applying surface and excellent in stress mitigating property. SOLUTION: The conductive paste 1 has a conductive filler 2, a resin filler 3, and a binder resin as principal constituents the aspect ratio of the conductive filler 2 obtained by dividing the average length in the direction of major axis of the conductive filler 2 by the average length in the direction of minor axis of the same is specified so as to be not less than 5. The aspect ratio of the resin filler 3 obtained by dividing the average length in the direction of major axis of the resin filler 3 by the average length in the direction of minor axis of the same is specified so as to be not more than 3. Further, a value obtained by dividing the average length in the direction of major axis of the conductive filler 2 by the average length in the direction of major axis of the resin filler 3 is specified so as to be not less than 0.05 and not more than 1. A value obtained by dividing the total volume of the conductive filler 2 contained in the conductive paste 1 by the total volume of the resin filler 3 is specified so as to be not less than 2 and not more than 5, while the coefficient of elasticity of the resin filler 3 is specified so as to be 10-2,400MPa. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004193250(A) 申请公布日期 2004.07.08
申请号 JP20020357859 申请日期 2002.12.10
申请人 HITACHI CHEM CO LTD 发明人 TAKEKOSHI MASAAKI;TANAKA TOSHIAKI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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