| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of electro-optical device capable of erasing micro-damages and cracks existing on a substrate edge and a cut face by etching without damaging wiring, and to provide an electro-optical device and an electronic equipment. SOLUTION: A liquid crystal panel 1' used for the electro-optical device is cut out into a single product size, then, before IC mounting, wet etching is performed on the substrate edges and the cut faces of a first substrate 10 and a second substrate 20 in the state of the liquid crystal panel 1' of a single product, and the micro-damages and the cracks are erased from the substrate edges and the cut faces. Then, wiring parts 51 and 71, IC mounting terminals 26 and 27, a substrate mounting terminal 28 and an alignment mark 55 formed on an overhang region 25 are covered with a protection layer 90. COPYRIGHT: (C)2004,JPO&NCIPI
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