发明名称 Filtered electrical connector assembly for an overmolded electronic package
摘要 An electronic package and filtered electrical connector assembly includes number of connector pins extending away from a main circuit board having a first ground plane, and an auxiliary circuit board having a second ground plane is positioned over the main circuit board with the connector pins extending therethrough and electrically connected to a corresponding number of capacitors mounted to the auxiliary circuit board. An inductive block and surrounding conductive spacer block are positioned between the main and auxiliary circuit boards with the connector pins extending through the inductive block and with the conductive spacer block electrically contacting the first and second ground planes. A connector shroud surrounds the connector pins extending through auxiliary circuit board, and all components are bonded together via an overmolding process to form the electronic package.
申请公布号 US2004132322(A1) 申请公布日期 2004.07.08
申请号 US20030337649 申请日期 2003.01.07
申请人 BRANDENBURG SCOTT D.;DEGENKOLB THOMAS A.;LAUDICK DAVID A. 发明人 BRANDENBURG SCOTT D.;DEGENKOLB THOMAS A.;LAUDICK DAVID A.
分类号 H01R13/719;H01R43/24;H05K1/02;H05K1/14;H05K3/28;(IPC1-7):H01R12/00 主分类号 H01R13/719
代理机构 代理人
主权项
地址