| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive element having a photosensitive resin composition layer which can sufficiently prevent production of air voids in the process of manufacturing a printed wiring board. <P>SOLUTION: The photosensitive element has a supporting film X, a protective film Y and a photosensitive resin composition layer Z between X and Y. The photosensitive resin composition as the material for Z contains a binder polymer A, a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond, and a photopolymerization initiator. The polymer A contains a repeating unit derived from styrene or a styrene derivative in the molecule, with 0.1 to 30 mass% content of the unit. The surface roughness (μm) of the inner surface of Y in contact with Z, and of the outer surface of Y not in contact with Z satisfies conditions specified by JIS B0601-1982: (1) Ra1≤0.15; (2) Rmax≤1.5; (3) 0.1≤Ra2≤0.8; and (4) 1≤Rmax2≤5. In these conditions, Ra1 represent the center line average roughness of the inner surface, Rmax1 represents the maximum height in the inner surface, Ra2 represents the center line roughness of the outer surface and Rmax2 represents the maximum height in the outer surface. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
