发明名称 METHOD AND DEVICE FOR PICKING UP DIE
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for sequentially picking up individually independent dies. SOLUTION: A porous suction plate 2 is arranged on an X-Y-Z stage 1, vacuum suction is performed by a suction chamber 3, a suction blocker 5 is arranged in the suction chamber 3 so as to be freely move in the vertical directions, and leakage covers 6, 7 which is freely movable in the X direction are formed so as to cover the upper surface of the porous suction plate 2. A collet 8, which is freely movable in the vertical and horizontal directions, is arranged on the same axial line as the suction blocker 5 on the upper position of the suction plate 2; a die to be picked up is arranged on the same axial line as the suction blocker 5 and the collet 8, and while the blocker 5 is brought into contact with the lower surface of the suction plate 2, to block the suction force; the die is picked up by the collet 8; and the surface of the suction plate 2, from which the picked-up die is drawn out, is covered with the leak covers 6, 7. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004193493(A) 申请公布日期 2004.07.08
申请号 JP20020362494 申请日期 2002.12.13
申请人 NEC MACHINERY CORP 发明人 NAKATSU AKIRA
分类号 H01L21/67;H01L21/52;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/67
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