| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve such a problem that it is necessary to improve heat transference between a coolant and a heat sink or to uniform retention temperature for cooling a plurality of electronic components with temperature dependency in the cooling sturtcure of a conventional electronic component and the flow rate of the coolant and pressure loss increase, thus inducing a large-sized cooling apparatus for supply the cooling to the electronic component and an increase in energy consumption. <P>SOLUTION: The heat sink is formed so that heat transference between a coolant flowing inside corresponding to the arrangement position of the electronic component to be cooled and itself may change according to a position in the flow direction, thus cooling the electronic component. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
