| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition system ähot wire CVD (chemical vapor deposition) system} by which unevenness in the film thickness of a thin film to be deposited on a substrate is improved, and the thin film of uniform film thickness is deposited on the surface of the substrate, and to provide a thin film deposition system (hot wire CVD system) by which a film with uniform quality is formed on the surface of a substrate. SOLUTION: As for the hot wire CVD system, a planar gas blowing-out body 43 having a hollow is arranged at the inside of a reaction chamber 40, catalytic bodies 44 are provided so as to be confronted with the main face of the gas blowing-out body 43, a substrate 42 for film deposition is arranged at the outside of the catalytic bodies 44, further, a plurality of gas blowing-out holes 45 are formed on the main face of the gas blowing-out body 43, and, the distribution density of the blowing-out holes 45 is made higher from the central part toward the outer circumferential part in the main face. COPYRIGHT: (C)2004,JPO&NCIPI
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