发明名称 |
ADHESIVE MATERIAL, ADHESIVE PRODUCT, AND CONNECTION STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive material having excellent heat-resistance, which can easily be peeled without damaging an adherend by light irradiation or heating the material, and to provide an adhesive product and a connection structure using the material. SOLUTION: The adhesive material comprises a compound represented by formula (1). The compound generates a gas by the light irradiation or the heating it, and at least part of the gas generated from the compound is emitted out of the material. COPYRIGHT: (C)2004,JPO&NCIPI
|
申请公布号 |
JP2004190009(A) |
申请公布日期 |
2004.07.08 |
申请号 |
JP20030372314 |
申请日期 |
2003.10.31 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
HATAKEI MUNEHIRO;FUKUOKA MASATERU;HAYASHI SATOSHI;DANJO SHIGERU;OYAMA YASUHIKO;SUGITA TAIHEI;SHIMOMURA KAZUHIRO;KITAJIMA GIICHI |
分类号 |
C09K3/10;C09J11/06;C09J201/00;(IPC1-7):C09J201/00 |
主分类号 |
C09K3/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|