发明名称 ADHESIVE MATERIAL, ADHESIVE PRODUCT, AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive material having excellent heat-resistance, which can easily be peeled without damaging an adherend by light irradiation or heating the material, and to provide an adhesive product and a connection structure using the material. SOLUTION: The adhesive material comprises a compound represented by formula (1). The compound generates a gas by the light irradiation or the heating it, and at least part of the gas generated from the compound is emitted out of the material. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004190009(A) 申请公布日期 2004.07.08
申请号 JP20030372314 申请日期 2003.10.31
申请人 SEKISUI CHEM CO LTD 发明人 HATAKEI MUNEHIRO;FUKUOKA MASATERU;HAYASHI SATOSHI;DANJO SHIGERU;OYAMA YASUHIKO;SUGITA TAIHEI;SHIMOMURA KAZUHIRO;KITAJIMA GIICHI
分类号 C09K3/10;C09J11/06;C09J201/00;(IPC1-7):C09J201/00 主分类号 C09K3/10
代理机构 代理人
主权项
地址
您可能感兴趣的专利