发明名称 Manufacturing method and method for operating treatment apparatus
摘要 The present invention provides a manufacturing method by which a substrate (typically, a TFT substrate) can be installed directly in a treatment apparatus by using a transfer container without transferring the substrate. It is possible to use the container efficiently and transfer different substrates in size with one container. A manufacturing method in which a substrate is directly installed in an electrostatic-protected transfer container by a substrate supplier, and then the container is directly installed a treatment apparatus by a substrate demander after transferring can be realized, thereby making it possible to transfer substrates such as a TFT substrate. A contamination of a substrate due to particles and electrostatic discharge damage of a TFT substrate can be avoided because a transferring operation is not needed. A manufacturing method in which a substrate holding portion of the container is replaced depending on the size of a substrate and different substrates in size can be transferred with one container may be employed.
申请公布号 US2004130073(A1) 申请公布日期 2004.07.08
申请号 US20030740417 申请日期 2003.12.22
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;MATSUDA NORIYUKI
分类号 B65D85/86;B65G49/06;H01L21/00;H01L21/673;H01L21/677;H01L21/68;H05H1/26;(IPC1-7):H05H1/26 主分类号 B65D85/86
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