发明名称 |
Manufacturing method and method for operating treatment apparatus |
摘要 |
The present invention provides a manufacturing method by which a substrate (typically, a TFT substrate) can be installed directly in a treatment apparatus by using a transfer container without transferring the substrate. It is possible to use the container efficiently and transfer different substrates in size with one container. A manufacturing method in which a substrate is directly installed in an electrostatic-protected transfer container by a substrate supplier, and then the container is directly installed a treatment apparatus by a substrate demander after transferring can be realized, thereby making it possible to transfer substrates such as a TFT substrate. A contamination of a substrate due to particles and electrostatic discharge damage of a TFT substrate can be avoided because a transferring operation is not needed. A manufacturing method in which a substrate holding portion of the container is replaced depending on the size of a substrate and different substrates in size can be transferred with one container may be employed.
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申请公布号 |
US2004130073(A1) |
申请公布日期 |
2004.07.08 |
申请号 |
US20030740417 |
申请日期 |
2003.12.22 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;MATSUDA NORIYUKI |
分类号 |
B65D85/86;B65G49/06;H01L21/00;H01L21/673;H01L21/677;H01L21/68;H05H1/26;(IPC1-7):H05H1/26 |
主分类号 |
B65D85/86 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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