Semiconducting device, especially substrate- or circuit board-free re-wiring device on chip or chip scale package, has re-wiring device attached to first chip surface and corresponding bearer surface

摘要

The device has a semiconducting chip with a contact device on a first surface, a bearer above the surface without the contact extending laterally above the chip and a structured re-wiring device for electrically connecting the chip's contact device to the connector. The re-wiring device is attached to the first surface of the chip and the corresponding surface of the bearer and the connector extends laterally over the width of the chip. The device has a semiconducting chip (10) with a contact device (11) on a first surface for providing an integrated electrical component, a bearer (12) above the surface without the contact extending laterally above the chip and a structured re-wiring device (13) for electrically connecting the contact device of the chip to the connector (14). The re-wiring device is attached to the first surface of the chip and the corresponding surface of the bearer and the connector extends laterally over the width of the chip. AN Independent claim is also included for the following: (a) a method of manufacturing an inventive device.