| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method, with which a highly reliable wafer level CSP can be manufactured at low cost, even when using a wafer of large aperture. <P>SOLUTION: A sharpened bump is formed on an electrode pad of a plurality of semiconductor devices integrated into a semiconductor wafer, and a sheet-like sealing resin is stuck on the surface of the wafer to cover the bump. In such a case, the bump is passed through the sheet-like sealing resin, and a tip of the bump is exposed. Thereafter, a wiring metal layer is formed on the surface of the sheet-like sealing resin to be connected with the bump, an external connecting terminal is provided at a predetermined position on the wiring metal layer, and the semiconductor devices are then segmented. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
