| 发明名称 |
Semiconductor device and method of manufacturing the same |
| 摘要 |
A semiconductor device comprises a semiconductor substrate, a conductive plug electrically connected to the semiconductor substrate, a silicon carbide film provided on the conductive plug, a metal compound film provided on the silicon carbide film and containing a metal carbide, and an electrode provided on the metal compound film.
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| 申请公布号 |
US2004130026(A1) |
申请公布日期 |
2004.07.08 |
| 申请号 |
US20030678061 |
申请日期 |
2003.10.06 |
| 申请人 |
IMAI KEITARO;YAMAKAWA KOJI |
发明人 |
IMAI KEITARO;YAMAKAWA KOJI |
| 分类号 |
H01L21/768;H01L21/02;H01L21/3205;H01L21/8242;H01L21/8246;H01L23/52;H01L27/105;H01L27/108;H01L27/115;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/768 |
| 代理机构 |
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