| 发明名称 |
THICK FILM CONDUCTOR COMPOSITIONS FOR USE ON ALUMINUM NITRIDE SUBSTRATES |
| 摘要 |
The invention is directed to a conductive thick film composition for use on an aluminum nitride substrate that utilizes a boron containing reactant and a metal oxide to promote adhesion. |
| 申请公布号 |
EP1434750(A2) |
申请公布日期 |
2004.07.07 |
| 申请号 |
EP20020801065 |
申请日期 |
2002.10.08 |
| 申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
WANG, YUELI;CARROLL, ALAN, FREDERICK |
| 分类号 |
H01B1/22;C04B41/51;C04B41/88;H01L23/15;H01L23/498;H05K1/09;(IPC1-7):C04B41/51 |
主分类号 |
H01B1/22 |
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