| 摘要 |
PURPOSE: A method and a package method are provided to reduce the weight of a display by using a thin sealing cap and allow for a mass production of organic electroluminescence devices. CONSTITUTION: A method for manufacturing a hall substrate comprises a first step of sequentially depositing a titanium thin film(221) and a copper thin film(222) on a glass substrate(210); a second step of forming a photoresist pattern on the copper thin film in such a manner that the photoresist pattern has a shape and a size same as the shape and the size of a sealing cap; a third step of permitting a metal structure(240) to be grown on the copper thin film where the photoresist pattern is not formed; a fourth step of removing the photoresist pattern by using a solvent; a fifth step of removing, by using a solvent, the metal thin film exposed in the fourth step; and a sixth step of forming a plurality of halls(270) at constant intervals on the glass substrate exposed in the fifth step.
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