| 摘要 |
PURPOSE: A liquid epoxy resin composition for semiconductor package is provided, to improve adhesive strength to metal components of semiconductor package, thereby enhancing moisture resistance and thermal impact resistance. CONSTITUTION: The liquid epoxy resin composition comprises 9-15 wt% of a naphthalene-based epoxy resin represented by the formula 1 and an amine-based epoxy resin represented by the formula 2; 10-15 wt% of a trialkyl tetrahydrophthalic anhydride represented by the formula 3 (wherein R1, R2 and R3 are independently an alkyl or alkenyl group, and the sum of carbons and hydrogen of R1, R2 and R3 satisfies C6H15) and methyl tetrahydrophthalic anhydride represented by the formula 4 as a curing agent; 0.1-0.5 wt% of an imidazole-based catalyst represented by the formula 5 as a curing accelerator (wherein R1, R2 and R3 are independently H or a methyl, ethyl, phenyl, cyanoethyl or benzyl group); 70-80 wt% of an inorganic filler; and 0.1-5 wt% of a sulfur-containing adhesive strength improver obtained by the addition reaction represented by the reaction scheme 1 (wherein R1 is a methoxy or ethoxy group, and R2 and R3 are independently H or a methyl group). |
