发明名称 |
Semiconductor element with insulating package |
摘要 |
The semiconductor component has a number of sheet metal mounting plates (30, 31, 32) contained within the insulating housing (4) and lying in a common plane. The mounting plates support the semiconductor switch elements (33-36) of a rectifier bridge, which are electrically coupled to the respective mounting plates. Pref., the housing contains 3 mounting plates, each formed integral with the terminal leads for the respective semicondcutor, provided by a single leadframe. The housing is pref. rectangular, with the terminal leads extending from the longitudinal housing sides. |
申请公布号 |
EP0696818(B1) |
申请公布日期 |
2004.07.07 |
申请号 |
EP19950111686 |
申请日期 |
1995.07.25 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
GRAF, ALFONS, DR.ING.;SOMMER, PETER;HUBER, PETER;SCHLOEGEL, XAVER |
分类号 |
H01L23/12;H01L23/495;H01L25/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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