发明名称 Semiconductor element with insulating package
摘要 The semiconductor component has a number of sheet metal mounting plates (30, 31, 32) contained within the insulating housing (4) and lying in a common plane. The mounting plates support the semiconductor switch elements (33-36) of a rectifier bridge, which are electrically coupled to the respective mounting plates. Pref., the housing contains 3 mounting plates, each formed integral with the terminal leads for the respective semicondcutor, provided by a single leadframe. The housing is pref. rectangular, with the terminal leads extending from the longitudinal housing sides.
申请公布号 EP0696818(B1) 申请公布日期 2004.07.07
申请号 EP19950111686 申请日期 1995.07.25
申请人 INFINEON TECHNOLOGIES AG 发明人 GRAF, ALFONS, DR.ING.;SOMMER, PETER;HUBER, PETER;SCHLOEGEL, XAVER
分类号 H01L23/12;H01L23/495;H01L25/00 主分类号 H01L23/12
代理机构 代理人
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