Semiconductor packaging structure

摘要

A packaging structure 30 for a semiconductor device 72 includes a substrate formed from first 50 and second 52 substrate layers, with a mounting surface 46 for surface-mounting on a circuit board at the rear of the second substrate layer 52. A device chip 34 is bonded at an upper surface of the chip, to a rear-facing surface of the second substrate layer 52 within a recess 48 in the same side of the substrate as the mounting surface. First substrate layer 50 has a hollow extending from the upper surface of the substrate, through to the recess at the chip position. The device 72 may be an optical sensor or imager, and a non-opaque cover 36 may be positioned over the hollow. The chip 34 may be sealed at its edges with highly viscous material, and encapsulated underneath 48.