METHOD FOR PLATING INNER WALL OF CAVITY OF E-BGA PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method is provided to reduce manufacturing costs and protect the plated layer formed on the inner wall of a cavity by plating the inner wall of the cavity with thin Au which is not etched by an etching solution. CONSTITUTION: A method comprises a step of forming an inner circuit of an E-BGA multi-layer printed circuit board and stacking Cu for an insulation layer and an outer layer circuit; a step of forming a cavity(603) in the portion where a chip is mounted through a punching process; a step of plating the surface of the printed circuit board and the inner wall of the cavity with Cu; a step of depositing a dry film(606) all over the printed circuit board excluding the inner wall of the cavity; a step of plating the inner wall of the cavity with Au; a step of forming a dry film pattern for forming an outer layer circuit on the printed circuit board; a step of etching the printed circuit board; a step of stripping off the dry film; a step of forming a photo solder resist layer; and a step of performing a surface treatment through a metal plating process.