INFRARED RAY PHOTO DETECTING MODULE MANUFACTURING METHOD AND PHOTO DETECTING MODULE THEREOF

摘要

PURPOSE: An infrared ray photo detecting module manufacturing method and photo detecting module thereof are provided to improve an outer noise shielding characteristic of a photo detecting device by introducing a wire bonding method in which a wire is disposed over the photo detecting device. CONSTITUTION: Respective leadframe and a base are molded by a press method(S1000). A photo detecting device and an IC(integrated circuit) chip interconnected to the photo detecting device are mounted on a surface of the base, and at least two of the leadframes and the IC chip are interconnection(S2000). A plurality of wires are so disposed in parallel over the photo detecting device, and both ends of each wire are thermally bonded to a surface of the base(S3000). The base is fixed and molded by thermosetting resin to form a case(S4000). Each leadframe electrically interconnected with the IC chip is insulated from the base(S5000).