COMPOUND METAL COLUMN FOR MOUNTING SEMICONDUCTOR DEVICE, CONTROLLING RATIO OF HEIGHT-TO-DIAMETER OF CONTACT MEMBER BY THICKNESS OF METAL SHEET OR DIAMETER OF STAMPING TOOL PIN

摘要

PURPOSE: A compound metal column for mounting a semiconductor device is provided to maximize endurance against a thermal mechanical stress by controlling a height to diameter ratio of a contact member according to a thickness of a metal sheet and a diameter of a stamping tool pin. CONSTITUTION: An IC(Integrated Circuit) chip(903) is connected to an external part by a reflow adhesion and includes a plurality of pads(903b) and a non-fluid contact member(1201). Each member has a height to diameter ratio and a substantially uniform diameter adapted for absorbing transformation under a thermal mechanical stress. The member includes a solderable surface(1202) on each end of the member and a fluid material layer on each end. The each member is soldered on a contact pad on one end, and the other end(1203) of each member in the IC is adapted to be reflow-adhered to the external part.