| 摘要 |
PURPOSE: An apparatus for fabricating a semiconductor device is provided to perform a planarization of high efficiency by using laser, and to completely eliminate the dependency upon the density of a pattern formed on a substrate by a cutting process using laser. CONSTITUTION: A rail of a predetermined lattice type is formed in an area corresponding to a semiconductor substrate, separated from the upper part of the semiconductor substrate by a predetermined interval. A step detecting unit(102) is mounted on the rail, recognizing the step of the patterned formed on the semiconductor substrate by using laser while moving with respect to the front surface of the semiconductor substrate. A pattern eliminating unit(103) is mounted on the rail, eliminating a predetermined thickness of the patterns of the semiconductor substrate by irradiating laser while moving with respect to the front surface of the semiconductor substrate. A center control unit(101) stores the information of the steps of the patterns inputted through the step detecting unit while eliminating a predetermined thickness of the patterns of the semiconductor substrate based on the step information by using the pattern eliminating unit.
|
