SPIN SCRUBBER OF SEMICONDUCTOR WAFER

摘要

PURPOSE: A spin scrubber of a semiconductor wafer is provided to improve a removal rate of a defect and prevent a loss of productivity from increasing by simultaneously performing a brush cleaning process and an ultrasonic cleaning process. CONSTITUTION: A spin cup(12) made of a cylindrical type having an opening in its upper part is formed on a support plate, capable of supporting the wafer in an increased position. A deionized water injecting nozzle(13) injects deionized water toward a wafer from a side of the spin cup, mounted on the spin cup. The wafer is placed on the upper plate of a spin chuck(17) that is rotated to uniformly distribute the deionized water to the wafer. A brush arm is located in the outside of a side of the spin cup. The brush arm has a brush(24) at its end and the end part of the brush arm can rotatively transfers to the wafer at a predetermined angle with respect to a fixed axis in a brush cleaning process. An ultrasonic wave generator(26) generates ultrasonic waves at the end part of the brush arm.