Quick sealing glass-lidded package fabrication method

摘要

A method of forming an image sensor package includes wire bonding bond pads of an image sensor to interior traces on a substrate with bond wires. A first optically curable material is applied to enclose the bond wires. A second optically curable material is applied between a lid and the substrate. The first and second optically curable materials are cured through the lid with ultraviolet radiation. The first and second optically curable materials are cured rapidly without heating thus minimizing the fabrication cost of the image sensor package.