发明名称 |
Crystalline silicon die array and method for assembling crystalline silicon sheets onto substrates |
摘要 |
An array of crystalline silicon dies on a substrate and a method for yielding the array are provided. The method comprises: delineating an array of die areas on a crystalline semiconductor wafer; implanting the die areas with hydrogen ions; overlying the die areas with a layer of polymer to form, for each die, an aggregate including a die area first wafer layer; polymerically bonding an optically clear carrier to the die areas; thermally annealing the wafer to induce breakage in the wafer; forming, for each die, an aggregate wafer second layer with a thickness less than the die thickness; and, for each die, conformably attaching the aggregate wafer second layer to a substrate. The substrate can have an area of up to approximately two square meters and the wafer second layer can have a thickness of greater than and equal to approximately 20 nanometers.
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申请公布号 |
US6759277(B1) |
申请公布日期 |
2004.07.06 |
申请号 |
US20030376776 |
申请日期 |
2003.02.27 |
申请人 |
SHARP LABORATORIES OF AMERICA, INC. |
发明人 |
FLORES JAMES S.;TAKAFUJI YUTAKA;DROES STEVEN R. |
分类号 |
G02F1/1345;H01L21/02;H01L21/336;H01L21/44;H01L21/78;H01L23/495;H01L27/12;H01L27/146;H01L29/786;(IPC1-7):H01L21/44 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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